Prior to making a material selection, it is important to consider factors like user interaction, thermal exposure (internally and externally), environmental conditions, component location, and design. Evaluating these variables will allow you to choose the right materials to support the manufacturability, longevity, and performance of your product.
This cost-efficient board is easy for designers and fabricators to work with because of its electrical and mechanical characteristics. The composition of the board results in predictable and consistent fabrication. This board type is ideal for automotive and wireless communication applications.
Flex-circuits have become increasingly popular and support the reduction of an application’s size and weight due to their flexibility, and are ideal for high temperature and high-density applications. This board type is ideal for medical and mobile consumer electronic applications Commonly manufactured using “Kapton”, a polyimide film-based material developed by Dupont Corporation, it is resistant to heat, has dimensional stability and a low dielectric constant of 3.6.
RF/Microwave/High Speed are commonly used and cost-effective laminates for boards due to their dielectric and thermal conductivity characteristics. These board types are ideal for technologies with a microprocessor and for wireless communication applications.
Hybrid circuit boards are created by combining standard FR4 laminate with other RF/microwave/high-speed laminates. This technique gives engineers more control over the design on desired layers while reducing costs by completing the board with standard FR4.